This is a plasma etch tool dedicated solely to deep silicon etch (DSE) processes. The tool has many process parameters (substrate temperature, ICP power, sample bias voltage, etc.) that can be tuned to improve user’s etch results.
The tool is equipped with gases for a Bosch DSE process (C4F8, SF6, and Ar) and oxygen for periodic chamber cleaning. The tool features the option to utilize a high or low frequency sample bias generator, for improved control of etch roughness and minimization of lateral etch on SOI samples. The tool includes a load lock and automated transfer arm for quick sample loading/unloading. Etch recipes are fully automated, and can be controlled by end point detection spectrometry software to improve the precision of etch stop. The tool can accommodate a maximum 4” Si wafer sample size.
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