CHA Mark 50 Features/Capability:
- Wide Range of Materials: Capable of evaporating wide range of elements, alloy metals, and other materials, accommodating diverse research needs.
- User-Friendly Interface: The user-friendly digital control interface allows for easy operation and monitoring of deposition parameters
- Very fast Pumpdown and Venting times: Allowing users reliable time management not having to wait long times for proper vacuum
- Versatile Substrate Holder: Versatile substrate holder accommodates various substrate sizes and configurations, supporting diverse experimental setups.
- Material Loading: Multiple material sources can be loaded simultaneously.
- Ability to deposit copper (Unlike our other Deposition tool ME06)
- Standard policies for usage The CHA-Mark 50: is a six-pocket e-beam evaporator used for depositing Cr, Ti, Al, Cu, Co, Au (As of right now). Other materials need to be cleared with the staff and tested by staff before use. The wafers are loaded on a liftoff or planetary substrate holder. The system will pump down to the base pressure of 9e-7 Torr using a cryo pump. The pumping speed is typically 5-15 minutes. The metal deposition thickness is measured in real-time by a crystal monitor to verify the deposited metal thicknesses.
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