PD01 is a Plasma-Therm 790 PECVD tool that is configured with 2% silane in helium to deposit high-quality silicon dioxide, silicon nitride, and amorphous silicon films at temperatures from 100 C to 300 C. The tool was donated to UTD in May 2004 by the Mykrolis Corporation. PD02 is also a Plasma-Therm 790 PECVD system that can deposit high quality silicon carbide, silicon oxide, silicon nitride films. The tool was purchased for the lab by Dr. Stuart Cogan in Fall 2013.
Process Data
Control Charts
Control Chart: Low-Stress Nitride
Control Chart: Silicon Carbide
Posted under Cleanroom