The Plasma-Therm plasma ICP etcher is configured for etching metallic films using chlorine based chemistries. Presently, Cl2, BCl3, O2, and Ar are installed on the object. The tool is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
Process Runs
Control Charts
Posted under Cleanroom