The PLASMA-THERM, formerly Oerlikon, plasma dielectric and DSE (Deep Silicon Etch) etcher is configured for etching films using fluorine based chemistries. Presently, SF6, CHF3, and C4F8 precursors are installed on the object. The object is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
Process Data
Control Charts
Control Chart: Silicon Nitride
Posted under Cleanroom