PE04 Plasma-Therm, Plasma Dielectric & Deep Silicon Etch

September 13, 2022

The PLASMA-THERM, formerly Oerlikon, plasma dielectric and DSE (Deep Silicon Etch) etcher is configured for etching films using fluorine based chemistries. Presently, SF6, CHF3, and C4F8 precursors are installed on the object. The object is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.

Process Data

Process Data: Silicon Nitride

Process Data: Silicon Oxide

Control Charts

Control Chart: Silicon Nitride

Control Chart: Silicon Oxide


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