The Tergeo Plus plasma equipment is designed to generate low pressure plasma using argon, oxygen or water vapor. The ions and neutral radicals generated inside the plasma can be used to etch or remove a thin layer of material from the surface of the samples placed inside the chamber. It can be used to change the surface energy of the samples and make surfaces hydrophilic.
The Tergeo plasma system consists of the following components: a sample chamber, a remote plasma source, an rf power supply, rf electrodes, rf antennas, a gas delivery system, plasma sensors, system control electronics and a touch screen user interface. The sample chamber is composed of a high purity quartz tube with an inner diameter of 160 mm. The depth of the sample chamber is 280 mm. There is a quartz shelf placed in the tube for sample holding. The RF power supply is maximum 300 Watt, equipped with automatic impedance matching capability. The electrodes are positioned above and below the quartz tube. During the standard “direct” mode operation, a plasma is ignited and maintained inside the quartz tube. There is also a so-called “downstream” mode operation, when the plasma is maintained in a remote chamber, and the sample receives only downstream neutral radicals. The following gases are available: Ar, O2 and H2O. The instrument can be programmed and run automatically.
Tergeo Plus Plasma Cleaner Manual
Posted under Cleanroom