The list below provides information on materials, chemicals, and gasses that may be utilized in the cleanroom. Always consult the manufacturer’s MSDS prior to utilizing any chemical. Please note that some of the chemicals listed here are supplied by research advisers for their own personal research. Chemicals that are supplied by the cleanroom are for general use by all users. If a chemical is labeled with an adviser’s name, please consult with the professor before using.
If you would like to bring new chemicals into the Cleanroom then you must fill out the request form.
Acids and Etchants
- Acetic Acid
- Aluminum Etchant Type A
- APS Copper Etchant 100
- Boric Acid
- Buffered Oxide Etch (BOE – Ammonium Fluoride + HF Mixtures)
- BOE 20:1
- BOE 7:1
- Chrome Etch – CR 7S
- Ferric Chloride
- Gold Etchant TFA
- Hydrochloric Acid (HCl), 37%
- Hydrofluoric Acid (HF), 49%
- Hydrofluoric Acid 10:1
- Hydrofluoric Acid 20:1
- Hydrofluoric Acid Dip 100:1
- Hydrofluoric Acid 1% (Premix HF and water)
- Hydrofluoric Acid 10% (Premix HF and water)
- Nickel Etchant TFG
- Nitric Acid
- Phosphoric Acid
- Ruthenium Etchant RU-44
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Titanium Etchant TFTN
- Titanium Nitride Etchant 22-7
- Tungsten Etchant TFW
Adhesives
Adhesion Promoters and Silane Compounds
Atomic Layer Deposition (ALD) precursors
Colloidal Suspensions
- 5 nm silver colloidal suspension nanoCompsix
- 20 nm silver colloidal suspension
- Aquadag E collodial graphite suspension
- Blueseeds diamond colloid
- Latex spheres–SEM standard
- MesoGold colloidal suspension
- Pelco Colloidial Silver Paste
- SPI Flash-Dry Silver Colloidal suspension
Coolants and Lubricants
Cryogenic Fluids
Detergents
Diffusion Dopants
Gases
- Argon (Ar)
- Ammonia, Anhydrous (NH3)
- Boron Trichloride (BCl3)
- Carbon Dioxide (CO2)
- Carbon Tetrafluoride (“Halocarbon 14” CF4)
- Carbon Tetrafluoride and Oxygen Mixture
- Chlorine (Cl2)
- Compressed Air
- Deuterium (D2)
- Deuterated Forming Gas (N2:D2) (see Forming Gas)
- Dichlorosilane (SiH2Cl2)
- Forming Gas (N2:H2; >5.7% H2 – Flammable)
- Forming Gas (N2:H2; <5.7% H2 – Nonflammable)
- Helium (He)
- Hydrogen (H2)
- Methane (CH4)
- Nitrogen (N2)
- Nitrous Oxide (N2O)
- Nitric Oxide (NO)
- Octaflurocyclobutane (C4F8)
- Oxygen (O2)
- Phosphine (PH3)
- Sulfur Hexafluoride (SF6)
- Silane (SiH4)
- Siline and inert (N2, He or Ar) mixture
- Silane and Helium Nonflammable mixture
- Silane and Nitrogen Nonflammable mixture
- Silane and Nitrogen Flammable mixture
- Trifluromethane (“Halocarbon 23” CHF3)
HF Antidote
Metal Alloys and Inorganic Compounds
Solid target for utilization in AJA Sputter systems and/or e-beam evaporators
- Bismuth Telluride (BiTe)
- Cadmium Telluride (CdTe)
- Carbon (graphite)
- Lanthanum Fluoride (LaF3)
- Lead Fluoride (PbF2)
- Lithium Fluoride (LiF)
- Lithium Phosphate (Li3PO4)
- Nickel (II) Chloride (NiCl2)
- Nickel Chromium (Ni/Cr)
- Nickel (II) sulfate (NiSO4)
- Silicon Carbide (SiC)
- Sodium phosphate dodecahydrate (Na3PO4 * 12H2O)
- Tungsten/Titanium (W/Ti)
- Zinc Selenide (ZnSe)
- Zinc Sulfide (ZnS)
Metal
- Aluminum (Al)
- Antimony (Sb)
- Bismuth (Bi)
- Boron (B)
- Calcium (Ca)
- Chromium (Cr)
- Cobalt (Co)
- Gold (Au)
- Hafnium (Hf)
- Iridium (Ir)
- Lanthanum (La)
- Magnesium (Mg)
- Molybdenum (Mo)
- Nickel (Ni)
- Niobium (Nb)
- Palladium (Pd)
- Platinum (Pt)
- Ruthenium (Ru)
- Selenium (Se)
- Silver (Ag)
- Tantalum (Ta)
- Tellurium (Te)
- Tin (Sn)
- Titanium (Ti)
- Tungsten (W)
- Vanadium (V)
- Zinc (Zn)
- Zirconium (Zr)
Miscellaneous
Organosilcon Polymers and Compounds
Oxides
- Alumina, aluminum oxide, sapphire (Al2O3)
- Dysprosium oxide (Dy2O3)
- FOx 12 Flowable Oxide
- FOx 15 Flowable Oxide
- Hafnium Oxide (HfO2)
- Indium Gallium Zinc Oxide (IGZO)
- Indium Tin Oxide (ITO)
- Iridium Oxide ( IrO2, IrOx, SIROF)
- Lanthanum Aluminate (LaAlO3)
- Lithium Cobalt Oxide (LiCoO2)
- Magnesium Oxide (MgO)
- Manganese dioxide (MnO2)
- Molybdenum oxide (MoO3)
- Nickel Oxide (NiO)
- Ruthenium Oxide (RuO2, RuOx)
- Silica, silicon dioxide (SiO2)
- Strontium Titanate (SrTiO3)
- Tantalum Oxide (Ta2O5)
- Tin Oxide (SnO2)
- Titanium Dioxide (TiO2)
- Titaniumsilica Film Type A –this product is no longer produced by the mfg (Emulsitone) and coating performance is not supported by warranty
- Vanadium Oxide (V2O5)
- Zinc Oxide (ZnO)
- Zirconium Oxide (ZrO2)
- Zirconium Silicate (ZrSiO4)
Oxidizers
Photoresists
- 950 PMMA A2—see last page for safety information. This compound is dissolved in anisole.
- 950 PMMA A4—see last page for safety information. This compound is dissolved in anisole.
- 950 PMMA A7— see last page for safety information. This compound is dissolved in anisole
- AZ 1512
- AZ 5214-E
- AZ nLOF 2020
- AZ P4620
- Cyclotene 3022-63
- Cyclotene 4026.46
- Dow Corning XR-1541 E-beam Resist in MiBK
- HD 4100 Polyimide
- HD 7110
- HD 8940
- HD 8961
- KMPR 50
- KMPR 1005
- LOR A Series
- LOR C series
- Megaposit SPR 220-3.0
- Megaposit SPR 220-7.0
- NANO 495 PMMA
- NR9-1000PY
- NR9-1500 P negative resist
- OSCoR ER1002 EP Orthogonal resist and photoacid generator
- S1805
- S1813
- S1818
- SIPR 7126M-20
- SML 50
- SML 600
- SU-8
- 5
- 50
- 2000.5
- 2002
- 2010
- 2015
- 2025
- 2050
- 2075
- 2100
Solvents, Strippers, and Organic Compounds
- 1-Methyl-2-pyrrolidone (NMP)
- 2-(methylthio)ethyl methacrylate
- 3-(trimethoxysilyl)propyl methacrylate
- 4-chlorothiophenol
- ACT 412 Resist Stripper
- AZ 400T Stripper
- AZ Remover 880
- AZ EBR Solvent
- AZ NMP Rinse/ (1-Methyl-2-pyrrolidone)
- Acetone ((CH3)2CO)
- Alane-N-methylpyrrolidine
- Amyl acetate/ pentyl acetate CH3COO[CH2]4CH3
- Anisole
- Benzene
- Biotin 3-sulfo-N-hydroxysuccinimide ester sodium salt
- Butyl ether/ dibutyl ether
- Chlorobenzene
- Chloroform/ trichloromethane (CHCl3)
- CYTOP CTX-809A
- Dibutyl Ether ([CH3(CH2)3]2O)
- Dichloromethane/methylene chloride
- Diethyl carbonate
- Diiodomethane
- Dimethylformamide–N,N-dimethylformamide, DMF
- Dow Corning WL-5150 Photopatternable Spin-On Silicone
- EBR PG Remover
- Ethanol 200 proof (CH3CH2OH)
- Ethylene glycol
- Ethyl Lactate
- Fluorinert FC-40
- Isopropanol–((CH3)2 CHOH), 2-propanol, isopropyl alcohol
- Glycerin C3H5(OH)3
- Glycerol
- Heptane
- Hexane
- Mesitylene (1,3,5-trimethylbenzene)
- Methanol –methyl alcohol (CH3OH)
- Methyl Ethyl Ketone–MEK, 2-butanone, (CH3C(O)CH2CH3)
- Methyl Isobutyl Ketone ((CH3)2CHCH2C(O)CH3)
- MicroChem A Thinner
- Microposit 1165 Remover
- Mowiol 18-88–this is a trademarked name for poly(vinyl)alcohol
- N,N-dimethylacetamide (DMAc)
- OmniCoat
- Orthogonal SR1 Rinse
- OPA 2311
- PA 400R solvent
- Parylene C
- Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate)–PEDOT:PSS
- Poly(propylene)carbonate–PCC
- Polystyrene
- Poly(tetrafluoroethylene)–(PTFE), Teflon
- Pyrrole
- Remover PG
- Resist Remover RR5
- Silver Paint Thinner
- Silver/Gold Extender
- Streptavidin
- SU-8 Thinner
- Technistrip N1555-05
- Toluene (C6H5-CH3)
- Trichloroethylene
- Tris(2-carboxyethyl) phosphine HCl
- VM 625